Power Supply in Package Chip Market Share Challenges Forecast (2020-2030). |MRFR Research Report.
Power Supply in Package Chip Market
The impending need for energy conservation has expedited the need for
microprocessors which can handle large power loads. Power supply in package
chip (PSiP) and power supply on chip (PwrSoC) are recent power conversion
technologies which can pave the path for future power management platforms. The
global PSiP and PwrSoC market report by Market Research Future (MRFR) considers
the various drivers and hurdles for the industry for the period of 2017 to 2023
(forecast period). The sudden outbreak of the COVID-19 virus and its impact are
analyzed in the report.
Market Scope
The global power
supply in package (PSiP) and power supply on chip (PwrSoC) market
is expected to reach a valuation exceeding USD 2,300 million by 2023, as per
the analysis of MRFR. The consumption of high-powered consumer electronic
devices is expected to drive the market demand during the forecast period.
Technologies advances in packaging of dies as well as customized solutions for
energy conservation can bode well for the market.
The low output voltage of these processors while following the trend of
miniaturization can culminate in a huge market demand. The integration of
off-the-shelf converters which lower development and design costs can bolster
the market demand. However, thermal challenges can impede the market growth.
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Segmentation
In 2017, the PSiP segment commanded for more than 89% share of the market in
terms of value. It is anticipated to reach a valuation in access of USD 2,000
Mn exhibiting a healthy growth rate till the end of the forecast period. PSiP
is used in automotive systems, portable devices, telecom devices, servers,
routers, set-top boxes, laptops, desktop systems, and medical devices.
The consumer electronics segment currently accounts for the lion’s share of
the market. The application is expected to reach a valuation of USD
1,354.4 Mn by 2023. The consumer electronics segment has been witnessing a
robust growth in recent years, consequently driving the demand for PSiPs and
PwrSoC.
Regional Analysis
Regions that were covered in the report include Europe, North America, Asia
Pacific (APAC), the Middle East & Africa (MEA), and South America. The
market in APAC is expected to remain highly attractive during the forecast
period. In 2017, APAC commanded 48.3% share of the market and projected to
exhibit 26.9% CAGR during the assessment period. The manufacturing sector in
the region has undergone massive transformation in recent years, which is
having a positive impact on the market in the region. China’s rise as a global
manufacturing hub has drawn significant investment in the countries.
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North America and Europe are the two other important markets for PSiP and
PwrSoC. During the review period, the market in North America is projected to
post a relatively higher CAGR, meanwhile Europe will retain its position as the
third largest power supply in package (PSiP) and power supply on chip (PwrSoC)
market.
Competitive Outlook
Amkor Technology, Texas Instruments Incorporated, Bel Fuse Inc., Panasonic
Corporation, ON Semiconductor, TDK Corporation, Intel Corporation, Vicor
Corporation, ASE Group, and Jiangsu Changjiang Electronics Technology Co. Ltd.
are key players of the global PSiP and PWoC market.
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